China's semiconductor manufacturing materials industry has developed into a fast lane

Abstract Since the party's eighteen, with the integration of semiconductor companies and the market economy, technological developments in the field of integrated circuit design, discrete device manufacturing, packaging, testing and other advances, semiconductor manufacturing materials industry entered a new stage of accelerated development, Significant achievements have been made. First, I...
Since the 18th National Congress of the Communist Party of China, with the integration of semiconductor enterprises and market economy, the technological development in the fields of integrated circuit design, discrete device manufacturing, packaging, and testing in China has been changing with each passing day. The semiconductor manufacturing materials industry has entered a new stage of accelerated development. Significant achievements.
First, China's semiconductor manufacturing materials technology and product quality have made great progress. Five years ago, China's 8-12-inch integrated circuit manufacturing materials were almost entirely imported. Driven by the special support of 02 and the National Integrated Circuit Industry Investment Fund and the preferential policies for supporting the integrated circuit industry, the independent research and development investment of materials enterprises has increased year by year, and has achieved very obvious results. Copper/copper barrier polishing fluid and series products produced by Anji Microelectronics, aluminum, titanium, copper and tantalum targets developed by Jiangfeng Electronics, NF3 and WF6 produced by CSIC 718 have entered integrated circuits at home and abroad. Production line, and batch application in advanced technology nodes, products can cover 130nm~28nm technology node requirements; Nanda Optoelectronics developed ultra-high purity phosphane, arsenic and safe source products have begun to supply domestic 8~12 inch integrated circuit production line and LED industry Projects such as 200mm silicon wafers and district-fused silicon single wafers have passed the acceptance test. Zhejiang Jinruiqi, Yanyan Semiconductor and Tianjin Huanou have good market performance in the current tight supply of silicon wafers; Shanghai Xinyang, Zhejiang The ultra-high-purity process chemicals of Kaisheng, Hubei Xingfu, Suzhou Jingrui and other companies have also entered or are entering the 8~12-inch integrated circuit line. A number of integrated circuit materials companies such as Nanda Optoelectronics, Shanghai Xinyang, Jiangyin Jianghuawei, Jiangfeng Electronics, and Suzhou Jingrui have successfully listed on the Main Board or the Growth Enterprise Market, opening a new channel for the innovation and development of enterprises.
Second, policy support promotes the rapid development of China's materials industry. In order to implement the economic deployment of the State Council, implement the plan for the steady growth of the integrated circuit industry, and promote the R&D, innovation, transformation and upgrading of related companies in the IC industry, the relevant ministries and commissions issued the “List of Duty Free Goods for Imported Production of Raw Materials and Consumables for Integrated Circuit Manufacturing Enterprises”. The commodities listed in the list are adjusted annually according to the development of the domestic industry. The implementation of this policy has played an important role in creating a level playing field for the domestic integrated circuit materials industry, and has opened up a broader development space for domestic semiconductor materials companies. The Ministry of Industry and Information Technology, together with the Ministry of Finance and the China Insurance Regulatory Commission, conducted pilot work on the application of insurance compensation mechanisms for the first batch of new materials, and also helped new products of integrated circuit materials to enter the market.
Third, technological innovation has opened up a new phase in the international market. The technical level, product quality and management system of some enterprises in China have been matched with international advanced technology nodes, and some products have begun to integrate into the international market, such as CMP polishing materials, sputtering targets, and underfill materials for advanced packaging processes. Advantages enter the international market; 12-inch silicon wafers are being developed in the 40~28nm node process. It is expected to form a monthly production capacity of 150,000 pieces by the end of 2017. It is expected to reach the 14nm integrated circuit manufacturing technology requirements in 2020; 248nm photoresist has been built. The engineering technology platform and serialized products are under development; serialized high-k dielectric precursors have also made breakthroughs and are developing high-end customers at home and abroad.

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Stainless steel plate surface smooth, high plasticity, toughness and mechanical strength, acid, alkaline gas, solution and other media corrosion resistance. It is an alloy steel that does not rust easily, but not absolutely. Stainless steel plate refers to the corrosion resistance of weak medium such as atmosphere, steam and water steel plate, and acid resistant steel plate refers to the corrosion resistance of chemical etched medium such as acid, alkali, salt steel plate.

According to the structure is divided into austenitic stainless steel plate, martensitic stainless steel plate (including precipitation hardening stainless steel plate), ferritic stainless steel plate, and austenitic ferritic biphase stainless steel plate and so on four categories? According to the main chemical composition of the steel plate or some characteristic elements in the steel plate to be classified into chromium stainless steel plate, chromium nickel stainless steel plate, chromium nickel molybdenum stainless steel plate and low carbon stainless steel plate, high molybdenum stainless steel plate, high purity stainless steel plate. According to the performance characteristics and use of steel plate classification, is divided into nitric acid resistant stainless steel plate, sulfuric acid resistant stainless steel plate, pitting stainless steel plate, stress corrosion resistant stainless steel plate, high strength stainless steel plate. According to the functional characteristics of the steel plate, it is divided into low temperature stainless steel plate, no magnetic stainless steel plate, easy cutting stainless steel plate, super plastic stainless steel plate. Currently, the commonly used classification method is according to the structural characteristics of steel plate and steel plate chemical composition characteristics and the combination of the two methods. Generally divided into martensitic stainless steel plate, ferritic stainless steel plate, austenitic stainless steel plate, duplex stainless steel plate and precipitation hardening type stainless steel plate or divided into chromium stainless steel plate and nickel stainless steel plate two categories.

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