Hippo Introduces SPG-40 New Grinding and Polishing Machine
Drawing Board,3D Magic Drawing Board,Light Up Pad For Drawing,Developing Drawing Board Guangdong Jishengke Industrial Co., Ltd. , https://www.suronart.com
The machine has the following characteristics:
1. The bed uses large-tonnage castings, which greatly improves the stability of the machine tool;
2. The spindle adopts high-precision electric spindle and has band speed control function to adapt to the processing of different products;
3. Three station tooling (loading material) can be oscillated +/-15 degrees. The speed and swing speed can be steplessly changed according to the processing object, so that the efficiency is higher. The maximum machining diameter is φ127mm when oscillating, and the machining diameter is not oscillating. Up to φ135mm, good surface quality;
4. The workpiece is pressurized with pneumatic device, which can accurately control the pressure, and conveniently and efficiently load and unload the workpiece;
5. Adopting the diamond grinding wheel developed by our company, the efficiency is faster and the processing quality is higher.
6. Single machine realizes grinding and polishing of diamond, reducing the input of mechanical equipment (non-standard, separate sand pump and sand bucket)
Scope of application Wide range of processing, simple equipment structure, good machine tool stability and unique processing methods. High-precision precision grinding and mirror polishing of diamond, cemented carbide, ceramics, gemstones and other materials through different grinding wheels, special tooling and special processes.